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The micro-droplet behavior of a molten lead-free solder in ..:
Tsai, M H
;
Hwang, W S
;
Chou, H H
Journal of Micromechanics and Microengineering. 19 (2009) 12 - p. 125021 , 2009
Link:
https://doi.org/10.1088/0960-1317/19/12/125021
RT Journal T1 <Title>The micro-droplet behavior of a molten lead-free solder in an inkjet printing process</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_0960-1317_19_12_125021&Exemplar=1&LAN=DE A1 Tsai, M H A1 Hwang, W S A1 Chou, H H PB IOP Publishing YR 2009 SN 0960-1317 SN 1361-6439 JF Journal of Micromechanics and Microengineering VO 19 IS 12 SP 125021 LK http://dx.doi.org/https://doi.org/10.1088/0960-1317/19/12/125021 DO https://doi.org/10.1088/0960-1317/19/12/125021 SF ELIB - SuUB Bremen
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