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Measurement of the mechanical stability of semiconductor li..:
Peter, Daniel
;
Dalmer, Michael
;
Lechner, Alfred
...
Journal of Micromechanics and Microengineering. 21 (2011) 2 - p. 025001 , 2011
Link:
https://doi.org/10.1088/0960-1317/21/2/025001
RT Journal T1 <Title>Measurement of the mechanical stability of semiconductor line structures in drying liquids with application to pattern collapse</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_0960-1317_21_2_025001&Exemplar=1&LAN=DE A1 Peter, Daniel A1 Dalmer, Michael A1 Lechner, Alfred A1 Gigler, Alexander M A1 Stark, Robert W A1 Bensch, Wolfgang PB IOP Publishing YR 2011 SN 0960-1317 SN 1361-6439 JF Journal of Micromechanics and Microengineering VO 21 IS 2 SP 025001 LK http://dx.doi.org/https://doi.org/10.1088/0960-1317/21/2/025001 DO https://doi.org/10.1088/0960-1317/21/2/025001 SF ELIB - SuUB Bremen
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