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1 Ergebnisse
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Development of vacuum underfill technology for a 3D chip st..:
Sakuma, Katsuyuki
;
Kohara, Sayuri
;
Sueoka, Kuniaki
...
Journal of Micromechanics and Microengineering. 21 (2011) 3 - p. 035024 , 2011
Link:
https://doi.org/10.1088/0960-1317/21/3/035024
RT Journal T1
Development of vacuum underfill technology for a 3D chip stack
UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_0960-1317_21_3_035024&Exemplar=1&LAN=DE A1 Sakuma, Katsuyuki A1 Kohara, Sayuri A1 Sueoka, Kuniaki A1 Orii, Yasumitsu A1 Kawakami, Mikio A1 Asai, Kazuo A1 Hirayama, Yoshikazu A1 Knickerbocker, John U PB IOP Publishing YR 2011 SN 0960-1317 SN 1361-6439 JF Journal of Micromechanics and Microengineering VO 21 IS 3 SP 035024 LK http://dx.doi.org/https://doi.org/10.1088/0960-1317/21/3/035024 DO https://doi.org/10.1088/0960-1317/21/3/035024 SF ELIB - SuUB Bremen
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