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1 Ergebnisse
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Wire-bonded through-silicon vias with low capacitive substr..:
Fischer, A C
;
Grange, M
;
Roxhed, N
...
Journal of Micromechanics and Microengineering. 21 (2011) 8 - p. 085035 , 2011
Link:
https://doi.org/10.1088/0960-1317/21/8/085035
RT Journal T1 <Title>Wire-bonded through-silicon vias with low capacitive substrate coupling</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_0960-1317_21_8_085035&Exemplar=1&LAN=DE A1 Fischer, A C A1 Grange, M A1 Roxhed, N A1 Weerasekera, R A1 Pamunuwa, D A1 Stemme, G A1 Niklaus, F PB IOP Publishing YR 2011 SN 0960-1317 SN 1361-6439 JF Journal of Micromechanics and Microengineering VO 21 IS 8 SP 085035 LK http://dx.doi.org/https://doi.org/10.1088/0960-1317/21/8/085035 DO https://doi.org/10.1088/0960-1317/21/8/085035 SF ELIB - SuUB Bremen
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