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1 Ergebnisse
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A new wafer level TSV build-up stacking using oxide bonding:
Kim, Sun-Rak
;
Song, Jun-Yeob
;
Lee, Seung S
.
Journal of Micromechanics and Microengineering. 23 (2013) 6 - p. 065015 , 2013
Link:
https://doi.org/10.1088/0960-1317/23/6/065015
RT Journal T1 <Title>A new wafer level TSV build-up stacking using oxide bonding</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_0960-1317_23_6_065015&Exemplar=1&LAN=DE A1 Kim, Sun-Rak A1 Song, Jun-Yeob A1 Lee, Seung S A1 Lee, Jae Hak PB IOP Publishing YR 2013 SN 0960-1317 SN 1361-6439 JF Journal of Micromechanics and Microengineering VO 23 IS 6 SP 065015 LK http://dx.doi.org/https://doi.org/10.1088/0960-1317/23/6/065015 DO https://doi.org/10.1088/0960-1317/23/6/065015 SF ELIB - SuUB Bremen
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