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1 Ergebnisse
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A hermetic and room-temperature wafer bonding technique bas..:
Braeuer, J
;
Gessner, T
Journal of Micromechanics and Microengineering. 24 (2014) 11 - p. 115002 , 2014
Link:
https://doi.org/10.1088/0960-1317/24/11/115002
RT Journal T1 <Title>A hermetic and room-temperature wafer bonding technique based on integrated reactive multilayer systems</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_0960-1317_24_11_115002&Exemplar=1&LAN=DE A1 Braeuer, J A1 Gessner, T PB IOP Publishing YR 2014 SN 0960-1317 SN 1361-6439 JF Journal of Micromechanics and Microengineering VO 24 IS 11 SP 115002 LK http://dx.doi.org/https://doi.org/10.1088/0960-1317/24/11/115002 DO https://doi.org/10.1088/0960-1317/24/11/115002 SF ELIB - SuUB Bremen
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