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1 Ergebnisse
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A double-lithography and double-reflow process and applicat..:
Zhang, Chaoqi
;
Yang, Hyung Suk
;
Bakir, Muhannad S
Journal of Micromechanics and Microengineering. 27 (2017) 2 - p. 025014 , 2017
Link:
https://doi.org/10.1088/1361-6439/aa5401
RT Journal T1 <Title>A double-lithography and double-reflow process and application to multi-pitch multi-height mechanical flexible interconnects</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_1361-6439_aa5401&Exemplar=1&LAN=DE A1 Zhang, Chaoqi A1 Yang, Hyung Suk A1 Bakir, Muhannad S PB IOP Publishing YR 2017 SN 0960-1317 SN 1361-6439 JF Journal of Micromechanics and Microengineering VO 27 IS 2 SP 025014 LK http://dx.doi.org/https://doi.org/10.1088/1361-6439/aa5401 DO https://doi.org/10.1088/1361-6439/aa5401 SF ELIB - SuUB Bremen
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