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1 Ergebnisse
1
3D chip stacking with through silicon-vias (TSVs) for verti..:
Le, Fuliang
;
Lee, Shi-Wei Ricky
;
Zhang, Qiming
Journal of Micromechanics and Microengineering. 27 (2017) 4 - p. 045012 , 2017
Link:
https://doi.org/10.1088/1361-6439/aa5dfc
RT Journal T1 <Title>3D chip stacking with through silicon-vias (TSVs) for vertical interconnect and underfill dispensing</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_1361-6439_aa5dfc&Exemplar=1&LAN=DE A1 Le, Fuliang A1 Lee, Shi-Wei Ricky A1 Zhang, Qiming PB IOP Publishing YR 2017 SN 0960-1317 SN 1361-6439 JF Journal of Micromechanics and Microengineering VO 27 IS 4 SP 045012 LK http://dx.doi.org/https://doi.org/10.1088/1361-6439/aa5dfc DO https://doi.org/10.1088/1361-6439/aa5dfc SF ELIB - SuUB Bremen
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