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The electromechanical behavior of piezoelectric thin film c..:
Griffin, B A
;
Williams, M D
;
Wang, G
...
Journal of Micromechanics and Microengineering. 27 (2017) 4 - p. 045017 , 2017
Link:
https://doi.org/10.1088/1361-6439/aa62b3
RT Journal T1 <Title>The electromechanical behavior of piezoelectric thin film composite diaphragms possessing in-plane stresses</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_1361-6439_aa62b3&Exemplar=1&LAN=DE A1 Griffin, B A A1 Williams, M D A1 Wang, G A1 Sankar, B V A1 Cattafesta, L N A1 Sheplak, M PB IOP Publishing YR 2017 SN 0960-1317 SN 1361-6439 JF Journal of Micromechanics and Microengineering VO 27 IS 4 SP 045017 LK http://dx.doi.org/https://doi.org/10.1088/1361-6439/aa62b3 DO https://doi.org/10.1088/1361-6439/aa62b3 SF ELIB - SuUB Bremen
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