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Residual stress measurement in a metal microdevice by micro..:
Song, Chang
;
Du, Liqun
;
Qi, Leijie
...
Journal of Micromechanics and Microengineering. 27 (2017) 10 - p. 105014 , 2017
Link:
https://doi.org/10.1088/1361-6439/aa8912
RT Journal T1 <Title>Residual stress measurement in a metal microdevice by micro Raman spectroscopy</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_1361-6439_aa8912&Exemplar=1&LAN=DE A1 Song, Chang A1 Du, Liqun A1 Qi, Leijie A1 Li, Yu A1 Li, Xiaojun A1 Li, Yuanqi PB IOP Publishing YR 2017 SN 0960-1317 SN 1361-6439 JF Journal of Micromechanics and Microengineering VO 27 IS 10 SP 105014 LK http://dx.doi.org/https://doi.org/10.1088/1361-6439/aa8912 DO https://doi.org/10.1088/1361-6439/aa8912 SF ELIB - SuUB Bremen
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