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1 Ergebnisse
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Polymer elastic bump formation through photodefinable therm..:
Lee, Chung Woo
;
Lee, Jae Hak
;
Song, Jun Yeob
...
Journal of Micromechanics and Microengineering. 28 (2018) 11 - p. 115008 , 2018
Link:
https://doi.org/10.1088/1361-6439/aadbd9
RT Journal T1 <Title>Polymer elastic bump formation through photodefinable thermal reflow process for system in foil package</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_1361-6439_aadbd9&Exemplar=1&LAN=DE A1 Lee, Chung Woo A1 Lee, Jae Hak A1 Song, Jun Yeob A1 Kim, Seung Man A1 Kim, Yong Jin A1 Kim, Chan PB IOP Publishing YR 2018 SN 0960-1317 SN 1361-6439 JF Journal of Micromechanics and Microengineering VO 28 IS 11 SP 115008 LK http://dx.doi.org/https://doi.org/10.1088/1361-6439/aadbd9 DO https://doi.org/10.1088/1361-6439/aadbd9 SF ELIB - SuUB Bremen
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