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1 Ergebnisse
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High-yield indium-based wafer bonding for large-area multi-..:
Klein, E
;
Gossler, C
;
Paul, O
..
Journal of Micromechanics and Microengineering. 29 (2019) 9 - p. 095006 , 2019
Link:
https://doi.org/10.1088/1361-6439/ab2a53
RT Journal T1 <Title>High-yield indium-based wafer bonding for large-area multi-pixel optoelectronic probes for neuroscientific research</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_1361-6439_ab2a53&Exemplar=1&LAN=DE A1 Klein, E A1 Gossler, C A1 Paul, O A1 Schwarz, U T A1 Ruther, P PB IOP Publishing YR 2019 SN 0960-1317 SN 1361-6439 JF Journal of Micromechanics and Microengineering VO 29 IS 9 SP 095006 LK http://dx.doi.org/https://doi.org/10.1088/1361-6439/ab2a53 DO https://doi.org/10.1088/1361-6439/ab2a53 SF ELIB - SuUB Bremen
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