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1 Ergebnisse
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Fatigue life evaluation of gold wire bonding solder joints ..:
Zhang, Yunfan
;
Wu, Kangkang
;
Shen, Shengnan
...
Journal of Micromechanics and Microengineering. 33 (2022) 2 - p. 025002 , 2022
Link:
https://doi.org/10.1088/1361-6439/aca913
RT Journal T1 <Title>Fatigue life evaluation of gold wire bonding solder joints in MEMS pressure sensors</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_1361-6439_aca913&Exemplar=1&LAN=DE A1 Zhang, Yunfan A1 Wu, Kangkang A1 Shen, Shengnan A1 Zhang, Quanyong A1 Cao, Wan A1 Liu, Sheng PB IOP Publishing YR 2022 SN 0960-1317 SN 1361-6439 JF Journal of Micromechanics and Microengineering VO 33 IS 2 SP 025002 LK http://dx.doi.org/https://doi.org/10.1088/1361-6439/aca913 DO https://doi.org/10.1088/1361-6439/aca913 SF ELIB - SuUB Bremen
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