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1 Ergebnisse
1
Effect of bonding adhesive thickness on temperature charact..:
Liu, Qiang
;
Yang, Wenlong
;
Li, Hongyuan
.
Journal of Micromechanics and Microengineering. 34 (2024) 3 - p. 035006 , 2024
Link:
https://doi.org/10.1088/1361-6439/ad2307
RT Journal T1 <Title>Effect of bonding adhesive thickness on temperature characteristics and strain characteristics of SAW strain sensors</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_1361-6439_ad2307&Exemplar=1&LAN=DE A1 Liu, Qiang A1 Yang, Wenlong A1 Li, Hongyuan A1 Xu, Hong PB IOP Publishing YR 2024 SN 0960-1317 SN 1361-6439 JF Journal of Micromechanics and Microengineering VO 34 IS 3 SP 035006 LK http://dx.doi.org/https://doi.org/10.1088/1361-6439/ad2307 DO https://doi.org/10.1088/1361-6439/ad2307 SF ELIB - SuUB Bremen
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