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1 Ergebnisse
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A novel plating bath device for reducing surface copper thi..:
Zeng, Guoxian
;
Zhang, Chi
;
Niu, Kai
..
Journal of Micromechanics and Microengineering. 34 (2024) 5 - p. 055004 , 2024
Link:
https://doi.org/10.1088/1361-6439/ad38ca
RT Journal T1 <Title>A novel plating bath device for reducing surface copper thickness and improving wafer-scale uniformity</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_1361-6439_ad38ca&Exemplar=1&LAN=DE A1 Zeng, Guoxian A1 Zhang, Chi A1 Niu, Kai A1 Wang, Fuliang A1 He, Hu PB IOP Publishing YR 2024 SN 0960-1317 SN 1361-6439 JF Journal of Micromechanics and Microengineering VO 34 IS 5 SP 055004 LK http://dx.doi.org/https://doi.org/10.1088/1361-6439/ad38ca DO https://doi.org/10.1088/1361-6439/ad38ca SF ELIB - SuUB Bremen
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