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1 Ergebnisse
1
Optimization of Package Heat Dissipation Design Based on Hi..:
Duan, Shihua
;
Li, Dejian
;
Guan, Yuan
...
Journal of Physics: Conference Series. 2645 (2023) 1 - p. 012003 , 2023
Link:
https://doi.org/10.1088/1742-6596/2645/1/012003
RT Journal T1 <Title>Optimization of Package Heat Dissipation Design Based on High-power WB-BGA Industrial Chip with a Wide Temperature Range</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_1742-6596_2645_1_012003&Exemplar=1&LAN=DE A1 Duan, Shihua A1 Li, Dejian A1 Guan, Yuan A1 Li, Bofu A1 Li, Dameng A1 Yang, Baobin A1 Han, Shunfeng PB IOP Publishing YR 2023 SN 1742-6588 SN 1742-6596 JF Journal of Physics: Conference Series VO 2645 IS 1 SP 012003 LK http://dx.doi.org/https://doi.org/10.1088/1742-6596/2645/1/012003 DO https://doi.org/10.1088/1742-6596/2645/1/012003 SF ELIB - SuUB Bremen
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