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1 Ergebnisse
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Assessment of piezoelectric sensor adhesive bonding:
Wandowski, T
;
Moll, J
;
Malinowski, P
..
Journal of Physics: Conference Series. 628 (2015) - p. 012114 , 2015
Link:
https://doi.org/10.1088/1742-6596/628/1/012114
RT Journal T1 <Title>Assessment of piezoelectric sensor adhesive bonding</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_1742-6596_628_1_012114&Exemplar=1&LAN=DE A1 Wandowski, T A1 Moll, J A1 Malinowski, P A1 Opoka, S A1 Ostachowicz, W PB IOP Publishing YR 2015 SN 1742-6588 SN 1742-6596 JF Journal of Physics: Conference Series VO 628 SP 012114 LK http://dx.doi.org/https://doi.org/10.1088/1742-6596/628/1/012114 DO https://doi.org/10.1088/1742-6596/628/1/012114 SF ELIB - SuUB Bremen
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