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Cooling of electronic components on the LTCC module with an..:
Nesterov, D A
;
Derevyanko, V A
;
Suntsov, S B
IOP Conference Series: Materials Science and Engineering. 1139 (2021) 1 - p. 012002 , 2021
Link:
https://doi.org/10.1088/1757-899x/1139/1/012002
RT Journal T1 <Title>Cooling of electronic components on the LTCC module with an embedded flat heat pipe</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_1757-899x_1139_1_012002&Exemplar=1&LAN=DE A1 Nesterov, D A A1 Derevyanko, V A A1 Suntsov, S B PB IOP Publishing YR 2021 SN 1757-8981 SN 1757-899X JF IOP Conference Series: Materials Science and Engineering VO 1139 IS 1 SP 012002 LK http://dx.doi.org/https://doi.org/10.1088/1757-899x/1139/1/012002 DO https://doi.org/10.1088/1757-899x/1139/1/012002 SF ELIB - SuUB Bremen
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