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Analysis of process limits for partial hot stamping with co..:
Reihani, A
;
Donat, L
;
Heibel, S
...
IOP Conference Series: Materials Science and Engineering. 1284 (2023) 1 - p. 012004 , 2023
Link:
https://doi.org/10.1088/1757-899x/1284/1/012004
RT Journal T1 <Title>Analysis of process limits for partial hot stamping with controlled pre-cooling by radiation exchange</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_1757-899x_1284_1_012004&Exemplar=1&LAN=DE A1 Reihani, A A1 Donat, L A1 Heibel, S A1 Schweiker, T A1 Gienger, M A1 Güner, A A1 Winderlich, M A1 Merklein, M PB IOP Publishing YR 2023 SN 1757-8981 SN 1757-899X JF IOP Conference Series: Materials Science and Engineering VO 1284 IS 1 SP 012004 LK http://dx.doi.org/https://doi.org/10.1088/1757-899x/1284/1/012004 DO https://doi.org/10.1088/1757-899x/1284/1/012004 SF ELIB - SuUB Bremen
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