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1 Ergebnisse
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Thermal interface material characterization for cryogenic e..:
Dillon, A
;
McCusker, K
;
Van Dyke, J
..
IOP Conference Series: Materials Science and Engineering. 278 (2017) - p. 012054 , 2017
Link:
https://doi.org/10.1088/1757-899x/278/1/012054
RT Journal T1 <Title>Thermal interface material characterization for cryogenic electronic packaging solutions</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_1757-899x_278_1_012054&Exemplar=1&LAN=DE A1 Dillon, A A1 McCusker, K A1 Van Dyke, J A1 Isler, B A1 Christiansen, M PB IOP Publishing YR 2017 SN 1757-8981 SN 1757-899X JF IOP Conference Series: Materials Science and Engineering VO 278 SP 012054 LK http://dx.doi.org/https://doi.org/10.1088/1757-899x/278/1/012054 DO https://doi.org/10.1088/1757-899x/278/1/012054 SF ELIB - SuUB Bremen
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