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Estimation of in-plane thermal conductivity of copper clad ..:
Niju Mohammed, K
;
Chanda, Samarjeet
IOP Conference Series: Materials Science and Engineering. 396 (2018) - p. 012054 , 2018
Link:
https://doi.org/10.1088/1757-899x/396/1/012054
RT Journal T1 <Title>Estimation of in-plane thermal conductivity of copper clad board by inverse analysis using artificial neural networks</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_1757-899x_396_1_012054&Exemplar=1&LAN=DE A1 Niju Mohammed, K A1 Chanda, Samarjeet PB IOP Publishing YR 2018 SN 1757-899X JF IOP Conference Series: Materials Science and Engineering VO 396 SP 012054 LK http://dx.doi.org/https://doi.org/10.1088/1757-899x/396/1/012054 DO https://doi.org/10.1088/1757-899x/396/1/012054 SF ELIB - SuUB Bremen
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