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The effect of CNT and Cu on interfacial intermetallic growt..:
Nur Liyana, M H
;
Azmah Hanim, M A
;
Sulaiman, Shamsuddin
.
IOP Conference Series: Materials Science and Engineering. 469 (2019) - p. 012007 , 2019
Link:
https://doi.org/10.1088/1757-899x/469/1/012007
RT Journal T1 <Title>The effect of CNT and Cu on interfacial intermetallic growth of Sn-Ag-Cu solder</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_1757-899x_469_1_012007&Exemplar=1&LAN=DE A1 Nur Liyana, M H A1 Azmah Hanim, M A A1 Sulaiman, Shamsuddin A1 Saliza Azlina, O PB IOP Publishing YR 2019 SN 1757-899X JF IOP Conference Series: Materials Science and Engineering VO 469 SP 012007 LK http://dx.doi.org/https://doi.org/10.1088/1757-899x/469/1/012007 DO https://doi.org/10.1088/1757-899x/469/1/012007 SF ELIB - SuUB Bremen
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