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1 Ergebnisse
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Three-dimensional stacking IC packaging technology for NAND..:
Perminov, V V
;
Putrolaynen, V V
;
Shtykov, A S
.
IOP Conference Series: Materials Science and Engineering. 537 (2019) 3 - p. 032064 , 2019
Link:
https://doi.org/10.1088/1757-899x/537/3/032064
RT Journal T1 <Title>Three-dimensional stacking IC packaging technology for NAND-flash memory</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_1757-899x_537_3_032064&Exemplar=1&LAN=DE A1 Perminov, V V A1 Putrolaynen, V V A1 Shtykov, A S A1 Yartsev, A V PB IOP Publishing YR 2019 SN 1757-8981 SN 1757-899X JF IOP Conference Series: Materials Science and Engineering VO 537 IS 3 SP 032064 LK http://dx.doi.org/https://doi.org/10.1088/1757-899x/537/3/032064 DO https://doi.org/10.1088/1757-899x/537/3/032064 SF ELIB - SuUB Bremen
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