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1 Ergebnisse
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Simulation and Analysis of Conductive Electromagnetic Inter..:
Lee, Chin-Hsiung
;
Hu, Qinjun
IOP Conference Series: Materials Science and Engineering. 611 (2019) 1 - p. 012084 , 2019
Link:
https://doi.org/10.1088/1757-899x/611/1/012084
RT Journal T1 <Title>Simulation and Analysis of Conductive Electromagnetic Interference in Near-Field Magnetic Coupling</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_1757-899x_611_1_012084&Exemplar=1&LAN=DE A1 Lee, Chin-Hsiung A1 Hu, Qinjun PB IOP Publishing YR 2019 SN 1757-8981 SN 1757-899X JF IOP Conference Series: Materials Science and Engineering VO 611 IS 1 SP 012084 LK http://dx.doi.org/https://doi.org/10.1088/1757-899x/611/1/012084 DO https://doi.org/10.1088/1757-899x/611/1/012084 SF ELIB - SuUB Bremen
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