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Optimization of copper electroplating process applied for m..:

Le, Nguyen Ngan ; Hue Phan, Thi Cam ; Le, Anh Duy..
Advances in Natural Sciences: Nanoscience and Nanotechnology.  6 (2015)  3 - p. 035007 , 2015
Link: https://doi.org/10.1088/2043-6262/6/3/035007