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1 Ergebnisse
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Lifetime engineering of bioelectronic implants with mechani..:
Niemiec, Martin
;
Kim, Kyungjin
Progress in Biomedical Engineering. 6 (2023) 1 - p. 012001 , 2023
Link:
https://doi.org/10.1088/2516-1091/ad0b19
RT Journal T1
Lifetime engineering of bioelectronic implants with mechanically reliable thin film encapsulations
UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_2516-1091_ad0b19&Exemplar=1&LAN=DE A1 Niemiec, Martin A1 Kim, Kyungjin PB IOP Publishing YR 2023 SN 2516-1091 JF Progress in Biomedical Engineering VO 6 IS 1 SP 012001 LK http://dx.doi.org/https://doi.org/10.1088/2516-1091/ad0b19 DO https://doi.org/10.1088/2516-1091/ad0b19 SF ELIB - SuUB Bremen
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