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1 Ergebnisse
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Grain-Boundary Resistance in Copper Interconnects: From an ..:
Valencia, Daniel
;
Wilson, Evan
;
Jiang, Zhengping
...
Physical Review Applied. 9 (2018) 4 - p. , 2018
Link:
https://doi.org/10.1103/physrevapplied.9.044005
RT Journal T1
Grain-Boundary Resistance in Copper Interconnects: From an Atomistic Model to a Neural Network
UL https://suche.suub.uni-bremen.de/peid=cr-10.1103_physrevapplied.9.044005&Exemplar=1&LAN=DE A1 Valencia, Daniel A1 Wilson, Evan A1 Jiang, Zhengping A1 Valencia-Zapata, Gustavo A. A1 Wang, Kuang-Chung A1 Klimeck, Gerhard A1 Povolotskyi, Michael PB American Physical Society (APS) YR 2018 SN 2331-7019 JF Physical Review Applied VO 9 IS 4 LK http://dx.doi.org/https://doi.org/10.1103/physrevapplied.9.044005 DO https://doi.org/10.1103/physrevapplied.9.044005 SF ELIB - SuUB Bremen
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