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1 Ergebnisse
1
Finite element analysis of thermal distributions of solder ..:
Boon Kar, Yap
;
Azrina Talik, Noor
;
Sauli, Zaliman
..
Microelectronics International. 30 (2013) 1 - p. 14-18 , 2013
Link:
https://doi.org/10.1108/13565361311298187
RT Journal T1
Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS
UL https://suche.suub.uni-bremen.de/peid=cr-10.1108_13565361311298187&Exemplar=1&LAN=DE A1 Boon Kar, Yap A1 Azrina Talik, Noor A1 Sauli, Zaliman A1 Siow Fei, Jean A1 Retnasamy, Vithyacharan PB Emerald YR 2013 SN 1356-5362 JF Microelectronics International VO 30 IS 1 SP 14 OP 18 LK http://dx.doi.org/https://doi.org/10.1108/13565361311298187 DO https://doi.org/10.1108/13565361311298187 SF ELIB - SuUB Bremen
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