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Lifetime prediction and design aspects of reliable lead-fre..:
Lappalainen, Jyrki
;
Uusimäki, Antti
;
Vähäkangas, Jouko
...
Soldering & Surface Mount Technology. 26 (2014) 3 - p. 117-128 , 2014
Link:
https://doi.org/10.1108/ssmt-07-2013-0018
RT Journal T1
Lifetime prediction and design aspects of reliable lead-free non-collapsible BGA joints in LTCC packages for RF/microwave telecommunication applications
UL https://suche.suub.uni-bremen.de/peid=cr-10.1108_ssmt-07-2013-0018&Exemplar=1&LAN=DE A1 Lappalainen, Jyrki A1 Uusimäki, Antti A1 Vähäkangas, Jouko A1 Kangasvieri, Tero A1 Nousiainen, Olli A1 Salmela, Olli A1 Putaala, Jussi PB Emerald YR 2014 SN 0954-0911 JF Soldering & Surface Mount Technology VO 26 IS 3 SP 117 OP 128 LK http://dx.doi.org/https://doi.org/10.1108/ssmt-07-2013-0018 DO https://doi.org/10.1108/ssmt-07-2013-0018 SF ELIB - SuUB Bremen
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