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1 Ergebnisse
1
Effect of Nano-Clay Filler on the Thermal Breakdown Mechani..:
Zhang, Chuyan
;
Shi, Weichen
;
Wang, Qiao
...
IEEE Access. 8 (2020) - p. 36055-36060 , 2020
Link:
https://doi.org/10.1109/access.2020.2972624
RT Journal T1
Effect of Nano-Clay Filler on the Thermal Breakdown Mechanism and Lifespan of Polypropylene Film Under AC Fields
UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_access.2020.2972624&Exemplar=1&LAN=DE A1 Zhang, Chuyan A1 Shi, Weichen A1 Wang, Qiao A1 Si, Zhicheng A1 Yang, Yankun A1 Liao, Yifan A1 Zhang, Fuzeng A1 Hiziroglu, Huseyin R. PB Institute of Electrical and Electronics Engineers (IEEE) YR 2020 SN 2169-3536 JF IEEE Access VO 8 SP 36055 OP 36060 LK http://dx.doi.org/https://doi.org/10.1109/access.2020.2972624 DO https://doi.org/10.1109/access.2020.2972624 SF ELIB - SuUB Bremen
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