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High-Temperature Characterizations of a Half-Bridge Wire-Bo..:
Chen, Yue
;
Lei, Guangyin
;
Lu, Guo-Quan
.
IEEE Journal of the Electron Devices Society. 9 (2021) - p. 966-971 , 2021
Link:
https://doi.org/10.1109/jeds.2021.3119428
RT Journal T1 <Title>High-Temperature Characterizations of a Half-Bridge Wire-Bondless SiC MOSFET Module</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_jeds.2021.3119428&Exemplar=1&LAN=DE A1 Chen, Yue A1 Lei, Guangyin A1 Lu, Guo-Quan A1 Mei, Yun-Hui PB Institute of Electrical and Electronics Engineers (IEEE) YR 2021 SN 2168-6734 JF IEEE Journal of the Electron Devices Society VO 9 SP 966 OP 971 LK http://dx.doi.org/https://doi.org/10.1109/jeds.2021.3119428 DO https://doi.org/10.1109/jeds.2021.3119428 SF ELIB - SuUB Bremen
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