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1 Ergebnisse
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Investigation of Photosensitive Polyimide With Low Coeffici..:
Huang, Yuan-Chiu
;
Hu, Han-Wen
;
Liu, Yun-Hsi
..
IEEE Journal of the Electron Devices Society. 12 (2024) - p. 96-103 , 2024
Link:
https://doi.org/10.1109/jeds.2024.3358830
RT Journal T1 <Title>Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_jeds.2024.3358830&Exemplar=1&LAN=DE A1 Huang, Yuan-Chiu A1 Hu, Han-Wen A1 Liu, Yun-Hsi A1 Hsieh, Hui-Ching A1 Chen, Kuan-Neng PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 2168-6734 JF IEEE Journal of the Electron Devices Society VO 12 SP 96 OP 103 LK http://dx.doi.org/https://doi.org/10.1109/jeds.2024.3358830 DO https://doi.org/10.1109/jeds.2024.3358830 SF ELIB - SuUB Bremen
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