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1 Ergebnisse
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Improvement of AlGaN/GaN HEMT Noise Figure Using Thick Cu M..:
Tseng, Howie
;
Lin, Yueh-Chin
;
Cheng, Chieh
...
IEEE Journal of the Electron Devices Society. 12 (2024) - p. 268-274 , 2024
Link:
https://doi.org/10.1109/jeds.2024.3381030
RT Journal T1 <Title>Improvement of AlGaN/GaN HEMT Noise Figure Using Thick Cu Metallization for Satellite Communication Applications</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_jeds.2024.3381030&Exemplar=1&LAN=DE A1 Tseng, Howie A1 Lin, Yueh-Chin A1 Cheng, Chieh A1 Chen, Po-Wei A1 Hsu, Heng-Tung A1 Tsao, Yi-Fan A1 Chang, Edward Yi PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 2168-6734 JF IEEE Journal of the Electron Devices Society VO 12 SP 268 OP 274 LK http://dx.doi.org/https://doi.org/10.1109/jeds.2024.3381030 DO https://doi.org/10.1109/jeds.2024.3381030 SF ELIB - SuUB Bremen
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