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1 Ergebnisse
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Adhesive Force Characterization for MEM Logic Relays With S..:
Yaung, Jack
;
Hutin, Louis
;
Jeon, Jaeseok
.
Journal of Microelectromechanical Systems. 23 (2014) 1 - p. 198-203 , 2014
Link:
https://doi.org/10.1109/jmems.2013.2269995
RT Journal T1 <Title>Adhesive Force Characterization for MEM Logic Relays With Sub-Micron Contacting Regions</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_jmems.2013.2269995&Exemplar=1&LAN=DE A1 Yaung, Jack A1 Hutin, Louis A1 Jeon, Jaeseok A1 Liu, Tsu-Jae King PB Institute of Electrical and Electronics Engineers (IEEE) YR 2014 SN 1057-7157 SN 1941-0158 JF Journal of Microelectromechanical Systems VO 23 IS 1 SP 198 OP 203 LK http://dx.doi.org/https://doi.org/10.1109/jmems.2013.2269995 DO https://doi.org/10.1109/jmems.2013.2269995 SF ELIB - SuUB Bremen
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