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1 Ergebnisse
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Evaluation of Chip-Package Interaction by Means of Stress S..:
Sun, Jingyao
;
Gabani, Dhruvit
;
Silber, Christian
...
IEEE Sensors Journal. 22 (2022) 13 - p. 12959-12966 , 2022
Link:
https://doi.org/10.1109/jsen.2022.3175576
RT Journal T1
Evaluation of Chip-Package Interaction by Means of Stress Sensors
UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_jsen.2022.3175576&Exemplar=1&LAN=DE A1 Sun, Jingyao A1 Gabani, Dhruvit A1 Silber, Christian A1 Dietz, Franz A1 Kabakchiev, Alexander A1 Gromala, Przemyslaw A1 Thewes, Roland A1 Pecanac, Goran PB Institute of Electrical and Electronics Engineers (IEEE) YR 2022 SN 1530-437X SN 1558-1748 SN 2379-9153 JF IEEE Sensors Journal VO 22 IS 13 SP 12959 OP 12966 LK http://dx.doi.org/https://doi.org/10.1109/jsen.2022.3175576 DO https://doi.org/10.1109/jsen.2022.3175576 SF ELIB - SuUB Bremen
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