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1 Ergebnisse
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A Three-Wafer-Stacked Hybrid 15-MPixel CIS + 1-MPixel EVS W..:
Guo, Menghan
;
Chen, Shoushun
;
Gao, Zhe
...
IEEE Journal of Solid-State Circuits. 58 (2023) 11 - p. 2955-2964 , 2023
Link:
https://doi.org/10.1109/jssc.2023.3303154
RT Journal T1 <Title>A Three-Wafer-Stacked Hybrid 15-MPixel CIS + 1-MPixel EVS With 4.6-GEvent/s Readout, In-Pixel TDC, and On-Chip ISP and ESP Function</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_jssc.2023.3303154&Exemplar=1&LAN=DE A1 Guo, Menghan A1 Chen, Shoushun A1 Gao, Zhe A1 Yang, Wenlei A1 Bartkovjak, Peter A1 Qin, Qing A1 Hu, Xiaoqin A1 Zhou, Dahai A1 Huang, Qiping A1 Uchiyama, Masayuki A1 Kudo, Yoshiharu A1 Fukuoka, Shimpei A1 Xu, Chengcheng A1 Ebihara, Hiroaki A1 Wang, Xueqing A1 Jiang, Peiwen A1 Jiang, Bo A1 Mu, Bo A1 Chen, Huan A1 Yang, Jason A1 Dai, T. J. A1 Suess, Andreas PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 0018-9200 SN 1558-173X JF IEEE Journal of Solid-State Circuits VO 58 IS 11 SP 2955 OP 2964 LK http://dx.doi.org/https://doi.org/10.1109/jssc.2023.3303154 DO https://doi.org/10.1109/jssc.2023.3303154 SF ELIB - SuUB Bremen
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