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1 Ergebnisse
1
Arvon: A Heterogeneous System-in-Package Integrating FPGA a..:
Tang, Wei
;
Cho, Sung-Gun
;
Hoang, Tim Tri
...
IEEE Journal of Solid-State Circuits. 59 (2024) 4 - p. 1235-1245 , 2024
Link:
https://doi.org/10.1109/jssc.2023.3343457
RT Journal T1 <Title>Arvon: A Heterogeneous System-in-Package Integrating FPGA and DSP Chiplets for Versatile Workload Acceleration</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_jssc.2023.3343457&Exemplar=1&LAN=DE A1 Tang, Wei A1 Cho, Sung-Gun A1 Hoang, Tim Tri A1 Botimer, Jacob A1 Zhu, Wei Qiang A1 Chang, Ching-Chi A1 Lu, Cheng-Hsun A1 Zhu, Junkang A1 Tao, Yaoyu A1 Wei, Tianyu A1 Motwani, Naomi Kavi A1 Yalamanchi, Mani A1 Yarlagadda, Ramya A1 Kale, Sirisha Rani A1 Flanigan, Mark A1 Chan, Allen A1 Tran, Thungoc A1 Shumarayev, Sergey A1 Zhang, Zhengya PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 0018-9200 SN 1558-173X JF IEEE Journal of Solid-State Circuits VO 59 IS 4 SP 1235 OP 1245 LK http://dx.doi.org/https://doi.org/10.1109/jssc.2023.3343457 DO https://doi.org/10.1109/jssc.2023.3343457 SF ELIB - SuUB Bremen
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