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1 Ergebnisse
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Effect of Impedance Discontinuity Induced by Line Bending o..:
Jin, Qiuyan
;
Feng, Quanyuan
;
Flowers, George T.
..
IEEE Microwave and Wireless Components Letters. 32 (2022) 9 - p. 1047-1050 , 2022
Link:
https://doi.org/10.1109/lmwc.2022.3168039
RT Journal T1 <Title>Effect of Impedance Discontinuity Induced by Line Bending on Passive Intermodulation in Connector-Microstrip Assemblies</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_lmwc.2022.3168039&Exemplar=1&LAN=DE A1 Jin, Qiuyan A1 Feng, Quanyuan A1 Flowers, George T. A1 Bi, Lingyu A1 Luo, Junyu PB Institute of Electrical and Electronics Engineers (IEEE) YR 2022 SN 1531-1309 SN 1558-1764 JF IEEE Microwave and Wireless Components Letters VO 32 IS 9 SP 1047 OP 1050 LK http://dx.doi.org/https://doi.org/10.1109/lmwc.2022.3168039 DO https://doi.org/10.1109/lmwc.2022.3168039 SF ELIB - SuUB Bremen
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