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Letter from the editor:
Sen, Osman
;
Cakir, Soydan
;
Tektas, Bahadir
.
IEEE Electromagnetic Compatibility Magazine. 6 (2017) 1 - p. 4-55 , 2017
Link:
https://doi.org/10.1109/memc.2017.7931811
RT Journal T1 <Title>Letter from the editor</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_memc.2017.7931811&Exemplar=1&LAN=DE A1 Sen, Osman A1 Cakir, Soydan A1 Tektas, Bahadir A1 Cetintas, Mustafa PB Institute of Electrical and Electronics Engineers (IEEE) YR 2017 SN 2162-2264 SN 2162-2272 JF IEEE Electromagnetic Compatibility Magazine VO 6 IS 1 SP 4 OP 55 LK http://dx.doi.org/https://doi.org/10.1109/memc.2017.7931811 DO https://doi.org/10.1109/memc.2017.7931811 SF ELIB - SuUB Bremen
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