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1 Ergebnisse
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Signal Integrity and Power Integrity:
Tripathi, Jai Narayan
;
Niu, Li
;
Hubing, Todd
IEEE Electromagnetic Compatibility Magazine. 12 (2023) 3 - p. 35-43 , 2023
Link:
https://doi.org/10.1109/memc.2023.10364702
RT Journal T1 <Title>Signal Integrity and Power Integrity</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_memc.2023.10364702&Exemplar=1&LAN=DE A1 Tripathi, Jai Narayan A1 Niu, Li A1 Hubing, Todd PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 2162-2264 SN 2162-2272 JF IEEE Electromagnetic Compatibility Magazine VO 12 IS 3 SP 35 OP 43 LK http://dx.doi.org/https://doi.org/10.1109/memc.2023.10364702 DO https://doi.org/10.1109/memc.2023.10364702 SF ELIB - SuUB Bremen
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