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1 Ergebnisse
1
Copper Encapsulated Ultra-Thin NbN Films and Damascene Stru..:
Kar, Soumen
;
Walker, Harrison
;
Shah, Archit
...
IEEE Transactions on Applied Superconductivity. 33 (2023) 5 - p. 1-5 , 2023
Link:
https://doi.org/10.1109/tasc.2023.3249127
RT Journal T1
Copper Encapsulated Ultra-Thin NbN Films and Damascene Structures on 300 mm Si Wafers
UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tasc.2023.3249127&Exemplar=1&LAN=DE A1 Kar, Soumen A1 Walker, Harrison A1 Shah, Archit A1 Frost, Hunter A1 Olson, Stephen A1 Mucci, John A1 Nalaskowski, Jakub A1 Martinick, Brian A1 Schujman, Sandra A1 Murray, Thomas A1 Johnson, Corbet S. A1 Wells, Ilyssa A1 Bourque, Ronald A1 Pierce, Stanley A1 Bhatia, Ekta A1 Hamilton, Michael C. A1 Rao, Satyavolu S. Papa PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 1051-8223 SN 1558-2515 SN 2378-7074 JF IEEE Transactions on Applied Superconductivity VO 33 IS 5 SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/tasc.2023.3249127 DO https://doi.org/10.1109/tasc.2023.3249127 SF ELIB - SuUB Bremen
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