Merkliste 
 1 Ergebnisse 
 
1

STPAcc: Structural TI-Based Pruning for Accelerating Distan..:

Wang, Yuke ; Feng, Boyuan ; Li, Gushu...
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  41 (2022)  5 - p. 1358-1370 , 2022