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1 Ergebnisse
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3D-TemPo: Optimizing 3-D DRAM Performance Under Temperature..:
Pandey, Shailja
;
Sethi, Sayam
;
Panda, Preeti Ranjan
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 43 (2024) 8 - p. 2263-2276 , 2024
Link:
https://doi.org/10.1109/tcad.2024.3367235
RT Journal T1 <Title>3D-TemPo: Optimizing 3-D DRAM Performance Under Temperature and Power Constraints</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcad.2024.3367235&Exemplar=1&LAN=DE A1 Pandey, Shailja A1 Sethi, Sayam A1 Panda, Preeti Ranjan PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 0278-0070 SN 1937-4151 JF IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems VO 43 IS 8 SP 2263 OP 2276 LK http://dx.doi.org/https://doi.org/10.1109/tcad.2024.3367235 DO https://doi.org/10.1109/tcad.2024.3367235 SF ELIB - SuUB Bremen
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