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1 Ergebnisse
1
On Legalization of Die Bonding Bumps and Pads for 3D ICs:
Huang, Yen-Hsiang
;
Pentapati, Sai
;
Agnesina, Anthony
..
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. , 2024
Link:
https://doi.org/10.1109/tcad.2024.3382835
RT Journal T1 <Title>On Legalization of Die Bonding Bumps and Pads for 3D ICs</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcad.2024.3382835&Exemplar=1&LAN=DE A1 Huang, Yen-Hsiang A1 Pentapati, Sai A1 Agnesina, Anthony A1 Brunion, Moritz A1 Lim, Sung Kyu PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 0278-0070 SN 1937-4151 JF IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems SP 1 OP 1 LK http://dx.doi.org/https://doi.org/10.1109/tcad.2024.3382835 DO https://doi.org/10.1109/tcad.2024.3382835 SF ELIB - SuUB Bremen
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