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Evaluation of Fatigue Behavior of Lead-Free Solder Joints i..:
Sabuncuoglu, Baris
;
Vanhee, Filip
;
Willems, Geert
..
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7 (2017) 12 - p. 1957-1964 , 2017
Link:
https://doi.org/10.1109/tcpmt.2017.2739808
RT Journal T1 <Title>Evaluation of Fatigue Behavior of Lead-Free Solder Joints in Four-Point Bending Test by Finite-Element Modeling</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2017.2739808&Exemplar=1&LAN=DE A1 Sabuncuoglu, Baris A1 Vanhee, Filip A1 Willems, Geert A1 Vandevelde, Bart A1 Vandepitte, Dirk PB Institute of Electrical and Electronics Engineers (IEEE) YR 2017 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 7 IS 12 SP 1957 OP 1964 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2017.2739808 DO https://doi.org/10.1109/tcpmt.2017.2739808 SF ELIB - SuUB Bremen
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