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CPU Overclocking: A Performance Assessment of Air, Cold Pla..:
Ramakrishnan, Bharath
;
Alissa, Husam
;
Manousakis, Ioannis
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11 (2021) 10 - p. 1703-1715 , 2021
Link:
https://doi.org/10.1109/tcpmt.2021.3106026
RT Journal T1 <Title>CPU Overclocking: A Performance Assessment of Air, Cold Plates, and Two-Phase Immersion Cooling</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2021.3106026&Exemplar=1&LAN=DE A1 Ramakrishnan, Bharath A1 Alissa, Husam A1 Manousakis, Ioannis A1 Lankston, Robert A1 Bianchini, Ricardo A1 Kim, Washington A1 Baca, Rich A1 Misra, Pulkit A. A1 Goiri, Inigo A1 Jalili, Majid A1 Raniwala, Ashish A1 Warrier, Brijesh A1 Monroe, Mark A1 Belady, Christian A1 Shaw, Mark A1 Fontoura, Marcus PB Institute of Electrical and Electronics Engineers (IEEE) YR 2021 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 11 IS 10 SP 1703 OP 1715 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2021.3106026 DO https://doi.org/10.1109/tcpmt.2021.3106026 SF ELIB - SuUB Bremen
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