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1 Ergebnisse
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A Novel Fabricating a Thick Film Cu-Ni Alloy Resistor by Sc..:
Kuo, C. R.
;
Kuo, Tzu-Chiang
;
Lee, Wen-Hsi
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11 (2021) 11 - p. 1997-2002 , 2021
Link:
https://doi.org/10.1109/tcpmt.2021.3121079
RT Journal T1 <Title>A Novel Fabricating a Thick Film Cu-Ni Alloy Resistor by Screen Printing an Al Electrode and Galvanic Replacement Reaction</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2021.3121079&Exemplar=1&LAN=DE A1 Kuo, C. R. A1 Kuo, Tzu-Chiang A1 Lee, Wen-Hsi PB Institute of Electrical and Electronics Engineers (IEEE) YR 2021 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 11 IS 11 SP 1997 OP 2002 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2021.3121079 DO https://doi.org/10.1109/tcpmt.2021.3121079 SF ELIB - SuUB Bremen
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