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1 Ergebnisse
1
Selection and Characterization of Photosensitive Polyimide ..:
Gao, Rongwei
;
Ma, Rui
;
Li, Jun
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12 (2022) 2 - p. 368-374 , 2022
Link:
https://doi.org/10.1109/tcpmt.2021.3127235
RT Journal T1
Selection and Characterization of Photosensitive Polyimide for Fan-Out Wafer-Level Packaging
UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2021.3127235&Exemplar=1&LAN=DE A1 Gao, Rongwei A1 Ma, Rui A1 Li, Jun A1 Su, Meiying A1 Hou, Fengze A1 Cao, Liqiang PB Institute of Electrical and Electronics Engineers (IEEE) YR 2022 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 12 IS 2 SP 368 OP 374 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2021.3127235 DO https://doi.org/10.1109/tcpmt.2021.3127235 SF ELIB - SuUB Bremen
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