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High-Density Hybrid Substrate for Heterogeneous Integration:
Peng, Tony Chia-Yu
;
Lau, John H.
;
Ko, Cheng-Ta
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12 (2022) 3 - p. 469-478 , 2022
Link:
https://doi.org/10.1109/tcpmt.2022.3151848
RT Journal T1 <Title>High-Density Hybrid Substrate for Heterogeneous Integration</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2022.3151848&Exemplar=1&LAN=DE A1 Peng, Tony Chia-Yu A1 Lau, John H. A1 Ko, Cheng-Ta A1 Lee, Paul A1 Lin, Eagle A1 Yang, Kai-Ming A1 Lin, Bruce Puru A1 Xia, Tim A1 Chang, Leo A1 Liu, Hsing-Ning A1 Lin, Curry A1 Lee, Tzu Nien A1 Wong, Jason A1 Ma, Mike A1 Tseng, Tzyy-Jang PB Institute of Electrical and Electronics Engineers (IEEE) YR 2022 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 12 IS 3 SP 469 OP 478 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2022.3151848 DO https://doi.org/10.1109/tcpmt.2022.3151848 SF ELIB - SuUB Bremen
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