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Study of Bondable Laser Release Material Using 355 nm Energ..:

Lee, Chia-Hsin ; Huang, Baron ; See, Jennifer...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  4 - p. 692-699 , 2022
Link: https://doi.org/10.1109/tcpmt.2022.3156730